Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, today unveiled its Bump Pitch Transformer design capabilities that slash 2.5D packaging NRE and production costs while significantly reducing design cycle time.
The new technology will open new artificial intelligence computing opportunities.
Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, today unveiled its Bump Pitch Transformer design capabilities that slash 2.5D packaging NRE and production costs while significantly reducing design cycle time. 